(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
In the ever-evolving world of electronics, high-frequency PCBs play a crucial role in enabling cutting-edge technologies. The Rogers TMM13i High-Frequency PCB, available in thicknesses of 15mil, 20mil, 25mil, and 60mil, is a standout choice for engineers and designers working on RF and microwave applications. With a high dielectric constant (DK) of 12.85 and a low dissipation factor of 0.0019, this PCB material is designed to deliver exceptional performance in demanding environments.
Key Features of Rogers TMM13i PCB
1.High Dielectric Constant (DK6.0): With a dielectric constant of 6.0, the TMM6 PCB is optimized for high-frequency applications, ensuring minimal signal loss and superior performance in RF and microwave circuits.
2.Low Dissipation Factor (0.0023): The low dissipation factor ensures efficient signal transmission, making it ideal for applications requiring high signal integrity.
3.Excellent Thermal Stability: TMM6 features a low thermal coefficient of dielectric constant and thermal expansion coefficients that closely match those of copper, ensuring reliable plated-through holes and minimal etch shrinkage.
4.High Thermal Conductivity: With approximately twice the thermal conductivity of traditional PTFE/ceramic laminates, TMM6 facilitates effective heat removal, making it suitable for high-power applications.
5.Immersion Gold Surface Finish: The immersion gold surface finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability.
Customizable Thickness Options: Available in 15mil, 20mil, 25mil, and 60mil thicknesses, the TMM13i PCB can be tailored to meet specific design requirements, making it versatile for a wide range of applications.
Applications
The Rogers TMM13i PCB is well-suited for a variety of high-frequency and high-power applications, including:
RF and Microwave Circuitry: Ideal for high-frequency signal transmission with minimal loss.
Satellite Communication Systems: Ensures reliable performance in space and terrestrial communication systems.
Global Positioning Systems (GPS) Antennas: Provides stable signal integrity for navigation and tracking systems.
Patch Antennas: Suitable for compact and high-performance antenna designs.
Power Amplifiers and Combiners: Delivers efficient power handling and signal integrity.
Filters and Couplers: Ensures precise signal filtering and coupling in RF systems.
Dielectric Polarizers and Lenses: Used in advanced optical and RF applications.
Chip Testers: Provides reliable performance for testing high-frequency components.
Our PCB Capability (TMM13i)
PCB Capability (TMM13i) |
|
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM13i |
Dielectric constant: |
12.85±0.35 |
Layer count: |
Single Layer,Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Dielectric thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, ENEPIG, Pure gold etc.. |
Why Choose Rogers TMM13i?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified
2.More than 18 years of high-frequency PCB experience
3.Small quantity orders available; no MOQ required
4.A team driven by passion, discipline, responsibility, and honesty
5.On-time delivery: >98%; Customer complaint rate: <1%
6.16,000㎡ workshop, 30,000㎡ output per month, and 8,000 types of PCBs monthly
7.Robust PCB capabilities to support your R&D, sales, and marketing efforts
8.IPC Class 2 / IPC Class 3
1.Certified Quality: We are ISO9001, ISO14001, IATF16949, ISO13485, and UL certified, ensuring the highest quality standards.
2.18+ Years of Experience: With over 18 years of experience in high-frequency PCB manufacturing, we deliver reliable and innovative solutions.
3.No MOQ Required: We accept small quantity orders with no minimum order quantity (MOQ).
4.On-Time Delivery: Our on-time delivery rate exceeds 98%, with a customer complaint rate of less than 1%.
5.Robust Production Capacity: Our 16,000㎡ workshop produces 30,000㎡ of PCBs monthly, supporting over 8,000 types of PCBs.
Our PCB Capability (TMM6)
PCB Capability (TMM6) |
|
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM6 |
Dielectric constant: |
6 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc.. |
Typical Values of TMM13i
The Rogers TMM13i High-Frequency PCB is a high-performance material designed to meet the demands of modern RF and microwave applications. With its high dielectric constant, low dissipation factor, and excellent thermal stability, it is an ideal choice for engineers working on advanced communication systems, satellite technology, and high-frequency circuitry.
Whether you're designing for 5G networks, satellite communications, or high-power RF systems, the TMM13i PCB offers the reliability and performance you need to bring your projects to life.
Typical Values of TMM13i
TMM13i Typical Value |
||||||
Property |
TMM13i |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
12.85±0.35 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Dielectric Constant,εDesign |
12.2 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor (process) |
0.0019 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Thermal Coefficient of dielectric constant |
-70 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
|
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
|
Volume Resistivity |
- |
- |
Mohm.cm |
- |
ASTM D257 |
|
Surface Resistivity |
- |
- |
Mohm |
- |
ASTM D257 |
|
Electrical Strength(dielectric strength) |
213 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
|
Thermal Properties |
||||||
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
|
Coefficient of Thermal Expansion - x |
19 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Y |
19 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Thermal Conductivity |
- |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
|
Mechanical Properties |
||||||
Copper Peel Strength after Thermal Stress |
4.0 (0.7) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
|
Flexural Strength (MD/CMD) |
- |
X,Y |
kpsi |
A |
ASTM D790 |
|
Flexural Modulus (MD/CMD) |
- |
X,Y |
Mpsi |
A |
ASTM D790 |
|
Physical Properties |
||||||
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.16 |
- |
% |
D/24/23 |
ASTM D570 |
3.18mm (0.125") |
0.13 |
|||||
Specific Gravity |
3 |
- |
- |
A |
ASTM D792 |
|
Specific Heat Capacity |
- |
- |
J/g/K |
A |
Calculated |
|
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |